ITW Dynatec's MR1300 High Flow Slot Die adhesive Applicator Head is and air-operated, singgle-module, hot melt adhesive applicator assembly commonly used in the pinch-bottom bag industry. A choice of bracketry allows setup for right or left hand or up or down apply applications, depending on requirements.

The applicator is heated by replaceable cartridge heating elements which are controlled by an intergrated RTD sensor and electronic control. High Flow applicators are available configured for ITW Dynatec's DyanControl, MTC/CompuVision or Allen-Bradley PLC controls.

• Independently heated die and service block
• Quick change slip-on-die lip
• Self centering die lip
• Titanium coated steel die adapter reduces wear and adhesive build-up
• Selectable hose inlets
• Symmetrical design mounting heads for change over versatility
• Head mounted adhesive pressure gauge