The ASU uses an extremely dependable, constant-pressure piston pump. the air operated pump insures a high pressure adhesive output from a low pressure, compressed air input.

The Dynamelt M Series hot melt adhesive supply units are available in three cabinet sizes and offer four hopper sizes. The Dynamelt M 35 Uses a microprocessor temperature control to closely control the temperature of hot melt adhesive for up to 4 hoses and 4 heads. Temperature set points are operator-selected for up to 16 zones and the system automatically provides warnings and alarms for operator errors and system malfunctions.

The Dyanmelt/DynaControl system provides accurate, proportionate temperature control for the hopper, hoses and applicators. Sequential heating delays may be programmed for turn-on of the hose and heads.

With these flexible temperature programming features, the Dynamelt system increases adhesive life by eliminating prolonged high adhesive temperatures. It reduces energy consumption and brings the system up to normal operating temperatures in the shortest possible time.

Available in four hopper sizes and with a choice of piston or gear pump, the Dynamelt S ASU uses a microprocessor temperature control to closely control the temperature of hot-melt adhesive for up to six hoses and six heads. Temperature setpoint are operator-selected for up to 14 zones and the system automatically provides warnings and alarms for operator errors and system malfunctions.

The Dynamelt system provides accurate, proporionate temperature control for the hopper, hoses and applicators. Sequential heating delays may be programmed for turn-on of the hoses and heads. A "standby" temperature may be programmed so that the temperature zones can be maintained at a lower temperature when the hot melt adhesive supply unit is not in active use, enabling rapid return to normal operation.

The Dynamelt S is available in four hopper sizes and with a choice of piston or gear pump, the Dynamelt S Adhesive supply unit uses a microprocessor temperature control to closely control the temperature of hot-melt adhesive for up to six hoses and six heads. Temperature setpoint are operator-selected for up to 14 zones and the system automatically provides warnings and alarms for operator errors and system malfunctions.

Staged melting minimizes the adhesive exposure to elevated temperatures and virtually eliminates char.

A full drum can be staged and ready to start the melting process when level sensors are activated.

Each APEX High Speed Slot Die applicator features various combinations of adhesive valve slot die modules mounted to a single service block. Each module is opened and closed by air pressure. Springs are used to keep needles closed when no air pressure is supplied to the head. The rate of adhesive flow from the applicator is determined by the adhesive pressure applied by the ASU’s pump, shim thickness and the amount of shim opening.

The applicator is heated by replaceable cartridge heating elements which are controlled by an integrated RTD sensor and electronic control. A single heat zone for the service block and die allows for only one temperature control point on models less than 390mm. Models longer than 390mm have two heat zones and control points. The APEX module(s) is mounted onto either a steel or aluminium service block. A piston inside the module is pneumatically triggered by a solenoid, which allows adhesive to flow through a valve within the module.

Each Mod-Plus Dyna BF applicator features on or more adhesive valve modules mounted to a single service block. Each module is opened and closed by air pressure. Springs are used to keep needles closed when no air pressure is supplied to the head. The rate of adhesive flow from the applicator is determined by the adhesive pressure applied by the ASU's pump and the size of the nozzle orifice.

Each Mod-Plus Dyna BF applicator features on or more adhesive valve modules mounted to a single service block. Each module is opened and closed by air pressure. Springs are used to keep needles closed when no air pressure is supplied to the head. The rate of adhesive flow from the applicator is determined by the adhesive pressure applied by the ASU's pump and the size of the nozzle orifice.

The applicator is heated by replacable cartridge heating elements which are controlled by intergrated RTD sensor and electronic control.

Each applicator features one Micro Optima module mounted to a single service block. The module is "optimized" (self-cleaning). It's nozzle is integrated into the module, making it maintenance free. The Micro Optima module is designed for high speed/high pressure (above 400 psi) applications where a sharp cutoff is necessary.

The applicator is heated by replaceable cartridge heating elements which are controlled by an integrated RTD sensor and electronic control.

The applicator is heated by replaceable cartridge heating elements which are controlled by integrated RTD sensor and electronic control.

Each Mod-Plus Electric applicator features one to four adhesive valve modules mounted to a single service block. Each module is opened and closed by an electric solenoid. Springs are used to keep the valve closed when no electric signal is supplied to the solenoid. The rate of adhesive flow from the applicator is determined by the adhesive pressure applied by the ASU's pump, the size of the nozzle orifice and the stem stroke adjustment.

The applicator is heated by replaceable cartridge heating elements which are controlled by an integrated RTD sensor and electronic control.

ITW Dynatec's MR1300 High Flow Slot Die adhesive Applicator Head is and air-operated, singgle-module, hot melt adhesive applicator assembly commonly used in the pinch-bottom bag industry. A choice of bracketry allows setup for right or left hand or up or down apply applications, depending on requirements.

The applicator is heated by replaceable cartridge heating elements which are controlled by an intergrated RTD sensor and electronic control. High Flow applicators are available configured for ITW Dynatec's DyanControl, MTC/CompuVision or Allen-Bradley PLC controls.

The DY 2008 Pattern Controller is one component of an adhesive application system consisting of a hot-melt unit, cold glue pressure vessel or cold glue pump, adhesive hoses and applicator heads. The controller can be used for hot-melt or cold glue application. The pattern controller activates solenoids for four (Basic Version) up to 128 (Option) applicator heads in order to create individual adhesive patterns. It is possible to program up to 16 independent glue events (16 glue + 16 delay) per channel. Each channel can operate in one of the possible modes: glue beads, dots, continuous gluing, random product length and stitching. Gluing can be triggered with a photo eye, proximity switch or by exceeding a certain machine speed.

Every channel may be assigned to its own trigger input, if desired, to increase the accuracy of multiple parallel running products. In order to accelerate the timing of solenoids it is possible to apply initially a higher voltage (Over-excitation). The voltage level and the duration time of this over-excitation is programmable via software on a channel-by-channel basis. This enables applications for hot-melt and cold glue.

All controls and displays are mounted inside a rugged enclosure with a protective door. The enclosure meets environmental rating of IP54, protecting against water and solid object infiltration when the door is latched and all output/input receptacles at the bottom of the DPC-2 Control Unit are either connected to cables or capped. The display is a bright, seven-segment LED device that affords easy viewing at any angle and in any lighting environment. All connectors are standardized to simplify installation.